2D X-Ray

PCBAs

High-resolution X-ray technology is widely used in failure analysis and production quality testing of electronic devices, e.g. solder joint inspection. Any material flaw and quality characteristic affecting the shape of solder joints can be detected:

  • Missing solder fillets
  • Voids, blisters
  • Solder bridges
  • Non-wetting defects

The fully automated µAXI inspection software x|act, the microme|x offers fast and easy CAD programming as well as highest defect coverage and repeatability.

A nanoCT® provides even more information

Solder Joint Inspection

 

Shop at our Webstore